ThinkSystem RAID 9350-8i 2GB Flash PCIe 12Gb Adapter
ThinkSystem ST50 V2 3.5 4TB 7.2K SATA 6Gb NHS 512n HDD
ThinkSystem ST50 V2 3.5 2TB 7.2K SATA 6Gb NHS 512n HDD
Acumulator Blackberry 9350 9360 9370 E-M1 Nu supuneti acumulatorul la surse de caldura! Evitati contactul acumulatorului cu obiecte metalice! Nu distrugeti sau dezmembrati acumulatorul! Capacitate 1000 mAh Tip celule Lithium-ion Tip produs Baterie Voltaj 3.7V
ThinkSystem 450W 230V 115V Titanium Hot-Swap Power Supply
ThinkSystem 32GB TruDDR4 3200 MHz (2Rx4 1.2V) RDIMM
NAS Lacie, 16TB, 2big RAID, USB 3.1, USB 3.0, Transfer speed: up to 440 MB s, 5 ani serviciul de Rescue Recovery, Negru
Husa originala Blackberry Pocket for 9350 9360 9370
Placa de baza MSI MAG B550 TOMAHAWK Socket AM4 911-7C91-001 4719072728625 Model Name MAG B550 TOMAHAWK CPU Support 3rd Gen AMD Ryzen, processors and future AMD Ryzen, processors with BIOS update CPU Socket AMD Socket AM4 Chipset AMD B550 Chipset Graphics Interface 1x PCI-E 4.0 x16 slot 1x PCI-E 3.0 x16 slot Support 2-way AMD CrossFire, Technology Display Interface DisplayPort, HDMI , Requires Processor Graphics Memory Support 4 DIMMs, Dual Channel DDR4-4866+(OC)Mhz Expansion Slots 2x PCI-E 3.0
ThinkSystem SR530 SR570 SR630 x16 PCIe LP Riser 2 Kit
ThinkSystem SR550 SR650 x16 x8 PCIe FH Riser 1 Kit
Placa de baza Gigabyte AMD B550M AORUS ELITE, 4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory 3rd Gen AMD Ryzen, Processors: Support for DDR4 4000(O.C.) 3600(O.C.) 3333(O.C.) 3200 2933 2667 2400 2133 MHz memory modules New Generation AMD Ryzen, with Radeon, Graphics processors: Support for DDR4 4733(O.C.) 4600(O.C.) 4400(O.C.) 4000(O.C.) 3600(O.C.) 3333(O.C.) 3200 2933 2667 2400 2133 MHz memory modules Dual channel memory architecture Supp
Placa de baza Asus AM4 PRIME B550-PLUS CPU Build in AMD AM4 Socket for 3rd Gen AMD Ryzen, and 3rd Gen AMD Ryzen, with Radeon, Graphics Processors Refer to www.asus.com for CPU support list Chipset AMD B550 Memory 3rd Gen AMD Ryzen, Processors 4 x DIMM, Max. 128GB, DDR4 4600(O.C) 4400(O.C) 4266(O.C.) 4133 (O.C.) 4000(O.C.) 3866(O.C.) 3733(O.C.) 3600(O.C.) 3466(O.C.) 3333 (O.C.) 3200 3000 2800 2666 2400 2133 MHz ECC and non-ECC, Un-buffered Memory 3rd Gen AMD Ryzen, with Radeon, Graphics
Placa de baza Asus PRIME A520M-K Socket LGA AM4 CPU Build in AMD AM4 Socket Processors Refer to www.asus.com for CPU support list Chipset AMD A520 Memory 2 x DIMM, Max. 64GB, DDR4 4600(O.C) 4400(O.C) 4000(O.C.) 3866(O.C.) 3733 (O.C.) 3600(O.C.) 3466(O.C.) 3333(O.C.) 3200 3000 2800 2666 2400 2133 MHz Un-buffered Memory Dual Channel Memory Architecture ECC Memory (ECC mode) support varies by CPU. Refer to www.asus.com for the Memory QVL (Qualified Vendors Lists). The maximum memory frequency supp
Placa de baza ASUS TUF B760M-PLUS DDR4 WIFI LGA1700 Model TUF GAMING B760M-PLUS WIFI D4 CPU Intel Socket LGA1700 for 13th Gen Intel Core, 12th Gen Intel Core, , Pentium Gold and Celeron Processors Supports Intel Turbo Boost Technology 2.0 and Intel Turbo Boost Max Technology 3.0 Refer to www.asus.com for CPU support list. Intel Turbo Boost Max Technology 3.0 support depends on the CPU types. Chipset Intel B760 Chipset Memory 4 x DIMM, Max. 128GB, DDR4 5333(OC) 5066(OC) 500
Placa de baza ASUS TUF B760-PLUS DDR4 WIFI LGA1700 Model TUF GAMING B760-PLUS WIFI D4 CPU Intel Socket LGA1700 for 13th Gen Intel Core, 12th Gen Intel Core, , Pentium Gold and Celeron Processors Supports Intel Turbo Boost Technology 2.0 and Intel Turbo Boost Max Technology 3.0 Refer to www.asus.com for CPU support list. Intel Turbo Boost Max Technology 3.0 support depends on the CPU types. Chipset Intel B760 Chipset Memory 4 x DIMM, Max. 128GB, DDR4 Non-ECC, Un-buffered Mem